Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer

Jinxing Liang, Liyuan Zhang, Ling Wang, Yuan Dong, Toshitsugu Ueda. Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer. Sensors, 15(9):22049-22059, 2015. [doi]

Abstract

Abstract is missing.