Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Dau Fatt Lim, Shiv Govind Singh, Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan. Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-5, IEEE, 2009. [doi]

This author has not been identified. Look up 'Dau Fatt Lim' in GoogleThis author has not been identified. Look up 'Shiv Govind Singh' in GoogleThis author has not been identified. Look up 'Xiao Fang Ang' in GoogleThis author has not been identified. Look up 'Jun Wei' in GoogleThis author has not been identified. Look up 'Chee Mang Ng' in GoogleThis author has not been identified. Look up 'Chuan Seng Tan' in Google

runs on WebDSL