Dau Fatt Lim, Shiv Govind Singh, Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan. Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-5, IEEE, 2009. [doi]
@inproceedings{LimSAWNT09,
title = {Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation},
author = {Dau Fatt Lim and Shiv Govind Singh and Xiao Fang Ang and Jun Wei and Chee Mang Ng and Chuan Seng Tan},
year = {2009},
doi = {10.1109/3DIC.2009.5306545},
url = {http://dx.doi.org/10.1109/3DIC.2009.5306545},
researchr = {https://researchr.org/publication/LimSAWNT09},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009},
publisher = {IEEE},
}