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Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC

Jai-Ming Lin, Wei-Yi Chang, Hao-Yuan Hsieh, Ya-Ting Shyu, Yeong-Jar Chang, Juin-Ming Lu. Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC. IEEE Trans. VLSI Syst., 29(9):1652-1664, 2021. [doi]

Authors

Jai-Ming Lin

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Wei-Yi Chang

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Hao-Yuan Hsieh

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Ya-Ting Shyu

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Yeong-Jar Chang

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Juin-Ming Lu

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