Jai-Ming Lin, Wei-Yi Chang, Hao-Yuan Hsieh, Ya-Ting Shyu, Yeong-Jar Chang, Juin-Ming Lu. Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC. IEEE Trans. VLSI Syst., 29(9):1652-1664, 2021. [doi]
Abstract is missing.