The following publications are possibly variants of this publication:
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- Thermal-Aware Fixed-Outline 3-D IC Floorplanning: An End-to-End Learning-Based ApproachWenbo Guan, XiaoYan Tang, Hongliang Lu, YuMing Zhang, YiMen Zhang. tvlsi, 31(12):1882-1895, December 2023. [doi]
- A Novel Thermal-Aware Floorplanning and TSV Assignment With Game Theory for Fixed-Outline 3-D ICsWenbo Guan, XiaoYan Tang, Hongliang Lu, YuMing Zhang, YiMen Zhang. tvlsi, 31(11):1639-1652, November 2023. [doi]
- A flexible fixed-outline floorplanning methodology for mixed-size modulesKai-Chung Chan, Chao-Jam Hsu, Jia-Ming Lin. aspdac 2013: 435-440 [doi]
- Routability-driven floorplanning algorithm for mixed-size modules with fixed-outline constraintJai-Ming Lin, Chih-Yao Hu, Kai-Chung Chan. vlsi-dat 2015: 1-4 [doi]
- F-FM: Fixed-Outline Floorplanning Methodology for Mixed-Size Modules Considering Voltage-Island ConstraintJai-Ming Lin, Ji-Heng Wu. tcad, 33(11):1681-1692, 2014. [doi]