Routability-Driven TSV-Aware Floorplanning Methodology for Fixed-Outline 3-D ICs

Jai-Ming Lin, Jung-An Yang. Routability-Driven TSV-Aware Floorplanning Methodology for Fixed-Outline 3-D ICs. IEEE Trans. on CAD of Integrated Circuits and Systems, 36(11):1856-1868, 2017. [doi]

Abstract

Abstract is missing.