A new IC interconnection scheme and design architecture for high performance ICs at very low fabrication cost - post passivation interconnection - researchr publication authors

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M. S. Lin, Ling Chen, J. Y. Lee, H. T. Liu, C. K. Chou, K. H. Wan, H. M. Chen, Kevin Chou, Roger Hsiao, Eric Lin. A new IC interconnection scheme and design architecture for high performance ICs at very low fabrication cost - post passivation interconnection. In Proceedings of the IEEE Custom Integrated Circuits Conference, CICC 2003, San Jose, CA, USA, September 21 - 24, 2003. pages 533-536, IEEE, 2003. [doi]

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