M. S. Lin, Ling Chen, J. Y. Lee, H. T. Liu, C. K. Chou, K. H. Wan, H. M. Chen, Kevin Chou, Roger Hsiao, Eric Lin. A new IC interconnection scheme and design architecture for high performance ICs at very low fabrication cost - post passivation interconnection. In Proceedings of the IEEE Custom Integrated Circuits Conference, CICC 2003, San Jose, CA, USA, September 21 - 24, 2003. pages 533-536, IEEE, 2003. [doi]
Abstract is missing.