M. S. Lin, Ling Chen, J. Y. Lee, H. T. Liu, C. K. Chou, K. H. Wan, H. M. Chen, Kevin Chou, Roger Hsiao, Eric Lin. A new IC interconnection scheme and design architecture for high performance ICs at very low fabrication cost - post passivation interconnection. In Proceedings of the IEEE Custom Integrated Circuits Conference, CICC 2003, San Jose, CA, USA, September 21 - 24, 2003. pages 533-536, IEEE, 2003. [doi]
@inproceedings{LinCLLCWCCHL03,
title = {A new IC interconnection scheme and design architecture for high performance ICs at very low fabrication cost - post passivation interconnection},
author = {M. S. Lin and Ling Chen and J. Y. Lee and H. T. Liu and C. K. Chou and K. H. Wan and H. M. Chen and Kevin Chou and Roger Hsiao and Eric Lin},
year = {2003},
doi = {10.1109/CICC.2003.1249454},
url = {https://doi.org/10.1109/CICC.2003.1249454},
researchr = {https://researchr.org/publication/LinCLLCWCCHL03},
cites = {0},
citedby = {0},
pages = {533-536},
booktitle = {Proceedings of the IEEE Custom Integrated Circuits Conference, CICC 2003, San Jose, CA, USA, September 21 - 24, 2003},
publisher = {IEEE},
isbn = {0-7803-7842-3},
}