Effects of width scaling and layout variation on dual damascene copper interconnect electromigration

M. H. Lin, K. P. Chang, K. C. Su, Tahui Wang. Effects of width scaling and layout variation on dual damascene copper interconnect electromigration. Microelectronics Reliability, 47(12):2100-2108, 2007. [doi]

Authors

M. H. Lin

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K. P. Chang

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K. C. Su

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Tahui Wang

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