M. H. Lin, K. P. Chang, K. C. Su, Tahui Wang. Effects of width scaling and layout variation on dual damascene copper interconnect electromigration. Microelectronics Reliability, 47(12):2100-2108, 2007. [doi]
@article{LinCSW07,
title = {Effects of width scaling and layout variation on dual damascene copper interconnect electromigration},
author = {M. H. Lin and K. P. Chang and K. C. Su and Tahui Wang},
year = {2007},
doi = {10.1016/j.microrel.2006.10.004},
url = {http://dx.doi.org/10.1016/j.microrel.2006.10.004},
tags = {layout, C++},
researchr = {https://researchr.org/publication/LinCSW07},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {47},
number = {12},
pages = {2100-2108},
}