Rung-Bin Lin, Da-Wei Hsu, Ming-Hsine Kuo, Meng-Chiou Wu. Reticle Exposure Plans for Multi-Project Wafers. In Patrick Girard, Andrzej Krasniewski, Elena Gramatová, Adam Pawlak, Tomasz Garbolino, editors, Proceedings of the 10th IEEE Workshop on Design & Diagnostics of Electronic Circuits & Systems (DDECS 2007), Kraków, Poland, April 11-13, 2007. pages 341-344, IEEE Computer Society, 2007.
Abstract is missing.