Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang. Pad assignment for die-stacking System-in-Package design. In 2009 International Conference on Computer-Aided Design (ICCAD 09), November 2-5, 2009, San Jose, CA, USA. pages 249-255, IEEE, 2009. [doi]
@inproceedings{LinMCW09,
title = {Pad assignment for die-stacking System-in-Package design},
author = {Yu-Chen Lin and Wai-Kei Mak and Chris Chu and Ting-Chi Wang},
year = {2009},
url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5361283},
tags = {design},
researchr = {https://researchr.org/publication/LinMCW09},
cites = {0},
citedby = {0},
pages = {249-255},
booktitle = {2009 International Conference on Computer-Aided Design (ICCAD 09), November 2-5, 2009, San Jose, CA, USA},
publisher = {IEEE},
}