The following publications are possibly variants of this publication:
- Pad Assignment for Die-Stacking System-in-Package DesignWai-Kei Mak, Yu-Chen Lin, Chris Chu, Ting-Chi Wang. tcad, 31(11):1711-1722, 2012. [doi]
- Temperature-constrained fixed-outline floorplanning for die-stacking system-in-package designDe-Yu Liu, Wai-Kei Mak, Ting-Chi Wang. glvlsi 2010: 423-428 [doi]
- PAD: A Design Space Exploration Model For Reconfigurable SystemsKang Sun, Xuezeng Pan, Jimin Wang, Lingdi Ping. itng 2007: 964-965 [doi]