Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang. Pad assignment for die-stacking System-in-Package design. In 2009 International Conference on Computer-Aided Design (ICCAD 09), November 2-5, 2009, San Jose, CA, USA. pages 249-255, IEEE, 2009. [doi]
Abstract is missing.