Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan. Alloying modification of Sn-Ag-Cu solders by manganese and titanium. Microelectronics Reliability, 49(3):235-241, 2009. [doi]
@article{LinSLCLU09,
title = {Alloying modification of Sn-Ag-Cu solders by manganese and titanium},
author = {Li-Wei Lin and Jenn-Ming Song and Yi-Shao Lai and Ying-Ta Chiu and Ning-Cheng Lee and Jun-Yen Uan},
year = {2009},
doi = {10.1016/j.microrel.2008.10.001},
url = {http://dx.doi.org/10.1016/j.microrel.2008.10.001},
researchr = {https://researchr.org/publication/LinSLCLU09},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {49},
number = {3},
pages = {235-241},
}