The following publications are possibly variants of this publication:
- The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature agingSun-Kyoung Seo, Sung K. Kang, Da-Yuan Shih, Hyuck Mo Lee. mr, 49(3):288-295, 2009. [doi]
- Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solderHyunju Lee, Cheolmin Kim, Cheolho Heo, Chiho Kim, Jae-Ho Lee, Yangdo Kim. mr, 87:75-80, 2018. [doi]