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Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan. Alloying modification of Sn-Ag-Cu solders by manganese and titanium. Microelectronics Reliability, 49(3):235-241, 2009. [doi]
Abstract is missing.