S.-H. Lin, Marko Simicic, N. Pantano, S. H. Chen, Geert Van der Plas, Eric Beyne, Piet Wambacq. Toward 0 V ESD Protection in 2.5D/3D Advanced Bonding Technology. In IEEE Symposium on VLSI Technology and Circuits 2024, Honolulu, HI, USA, June 16-20, 2024. pages 1-2, IEEE, 2024. [doi]
Abstract is missing.