Enabling inter-die co-optimization in 3-D IC with TSVs - researchr publication authors

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Chang-Tzu Lin, Tsu-Wei Tseng, Yung-Fa Chou, Chia-Hsin Lee, Ding-Ming Kwai. Enabling inter-die co-optimization in 3-D IC with TSVs. In 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, April 22-24, 2013. pages 1-4, IEEE, 2013. [doi]

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