Chang-Tzu Lin, Tsu-Wei Tseng, Yung-Fa Chou, Chia-Hsin Lee, Ding-Ming Kwai. Enabling inter-die co-optimization in 3-D IC with TSVs. In 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, April 22-24, 2013. pages 1-4, IEEE, 2013. [doi]
@inproceedings{LinTCLK13,
title = {Enabling inter-die co-optimization in 3-D IC with TSVs},
author = {Chang-Tzu Lin and Tsu-Wei Tseng and Yung-Fa Chou and Chia-Hsin Lee and Ding-Ming Kwai},
year = {2013},
doi = {10.1109/VLDI-DAT.2013.6533885},
url = {http://dx.doi.org/10.1109/VLDI-DAT.2013.6533885},
researchr = {https://researchr.org/publication/LinTCLK13},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, April 22-24, 2013},
publisher = {IEEE},
isbn = {978-1-4673-4435-7},
}