Substrate Topological Routing for High-Density Packages - researchr publication authors

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Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Tianpei Zhang, Robi Dutta, Xianlong Hong. Substrate Topological Routing for High-Density Packages. IEEE Trans. on CAD of Integrated Circuits and Systems, 28(2):207-216, 2009. [doi]

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