The following publications are possibly variants of this publication:
- Topological routing to maximize routability for package substrateShenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Tianpei Zhang, Robi Dutta, Xianlong Hong. dac 2008: 566-569 [doi]
- Diffusion-driven congestion reduction for substrate topological routingShenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Robi Dutta, Xianlong Hong. ispd 2009: 175-180 [doi]
- Effective congestion reduction for IC package substrate routingShenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Robi Dutta, Xianlong Hong. todaes, 15(3), 2010. [doi]
- Substrate Signal Routing Solution Exploration for High-Density Packages with Machine LearningYeu-Haw Yeh, Simon Yi-Hung Chen, Hung-Ming Chen, Deng-Yao Tu, Guan-Qi Fang, Yun-Chih Kuo, Po-Yang Chen. vlsi-dat 2022: 1-4 [doi]