Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Tianpei Zhang, Robi Dutta, Xianlong Hong. Substrate Topological Routing for High-Density Packages. IEEE Trans. on CAD of Integrated Circuits and Systems, 28(2):207-216, 2009. [doi]
@article{LiuCJHZDH09,
title = {Substrate Topological Routing for High-Density Packages},
author = {Shenghua Liu and Guoqiang Chen and Tom Tong Jing and Lei He and Tianpei Zhang and Robi Dutta and Xianlong Hong},
year = {2009},
doi = {10.1109/TCAD.2008.2009154},
url = {http://dx.doi.org/10.1109/TCAD.2008.2009154},
tags = {routing},
researchr = {https://researchr.org/publication/LiuCJHZDH09},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {28},
number = {2},
pages = {207-216},
}