An integrated algorithm for 3D-IC TSV assignment - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Xiaodong Liu, Yifan Zhang, Gary K. Yeap, Xuan Zeng. An integrated algorithm for 3D-IC TSV assignment. In Leon Stok, Nikil D. Dutt, Soha Hassoun, editors, Proceedings of the 48th Design Automation Conference, DAC 2011, San Diego, California, USA, June 5-10, 2011. pages 652-657, ACM, 2011. [doi]

This author has not been identified. It may be one of the following persons:

Xiaodong Liu

Look up 'Xiaodong Liu' in GoogleThis author has not been identified. Look up 'Yifan Zhang' in GoogleThis author has not been identified. Look up 'Gary K. Yeap' in GoogleThis author has not been identified. Look up 'Xuan Zeng' in Google

runs on WebDSL