Xianshu Luo, Yulian Cao, Junfeng Song, Xiaonan Hu, Tsung-Yang Liow, Mingbin Yu, Qijie Wang, Guo-Qiang Lo. High-throughput multiple dies-to-wafer (D2W) bonding for III/V-on-Si hybrid lasers. In Optical Fiber Communications Conference and Exhibition, OFC 2015, Los Angeles, CA, USA, March 22-26, 2015. pages 1-3, IEEE, 2015. [doi]
Abstract is missing.