The following publications are possibly variants of this publication:
- Design and manufacturing enablement for three-dimensional (3D) integrated circuits (ICs)Arifur Rahman, Hong Shi, Zhe Li, Dale Ibbotson, Sesh Ramaswami. cicc 2012: 1-8 [doi]
- Experimental characterization and model validation of thermal hot spots in 3D stacked ICsOprins, H., Cherman, V., Adi Srinivasan, Cupak, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Cheng, E.. Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, :1-5, 2010.
- Reliable Design of Three-Dimensional Integrated CircuitsShengcheng Wang. PhD thesis, Karlsruhe University, Germany, 2018. [doi]