A. M. Majid, David C. Keezer, Jayasanker Jayabalan, Mihai Rotaru. Multi-Gigahertz Testing of Wafer-Level Packaged Devices. In Scott Davidson, Anne Gattiker, editors, 2006 IEEE International Test Conference, ITC 2006, Santa Clara, CA, USA, October 22-27, 2006. pages 1-10, IEEE, 2006. [doi]
@inproceedings{MajidKJR06,
title = {Multi-Gigahertz Testing of Wafer-Level Packaged Devices},
author = {A. M. Majid and David C. Keezer and Jayasanker Jayabalan and Mihai Rotaru},
year = {2006},
doi = {10.1109/TEST.2006.297669},
url = {http://dx.doi.org/10.1109/TEST.2006.297669},
researchr = {https://researchr.org/publication/MajidKJR06},
cites = {0},
citedby = {0},
pages = {1-10},
booktitle = {2006 IEEE International Test Conference, ITC 2006, Santa Clara, CA, USA, October 22-27, 2006},
editor = {Scott Davidson and Anne Gattiker},
publisher = {IEEE},
isbn = {1-4244-0292-1},
}