Multi-Gigahertz Testing of Wafer-Level Packaged Devices

A. M. Majid, David C. Keezer, Jayasanker Jayabalan, Mihai Rotaru. Multi-Gigahertz Testing of Wafer-Level Packaged Devices. In Scott Davidson, Anne Gattiker, editors, 2006 IEEE International Test Conference, ITC 2006, Santa Clara, CA, USA, October 22-27, 2006. pages 1-10, IEEE, 2006. [doi]

Abstract

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