Sravan K. Marella, Sachin S. Sapatnekar. A Holistic Analysis of Circuit Performance Variations in 3-D ICs With Thermal and TSV-Induced Stress Considerations. IEEE Trans. VLSI Syst., 23(7):1308-1321, 2015. [doi]
@article{MarellaS15,
title = {A Holistic Analysis of Circuit Performance Variations in 3-D ICs With Thermal and TSV-Induced Stress Considerations},
author = {Sravan K. Marella and Sachin S. Sapatnekar},
year = {2015},
doi = {10.1109/TVLSI.2014.2335154},
url = {http://dx.doi.org/10.1109/TVLSI.2014.2335154},
researchr = {https://researchr.org/publication/MarellaS15},
cites = {0},
citedby = {0},
journal = {IEEE Trans. VLSI Syst.},
volume = {23},
number = {7},
pages = {1308-1321},
}