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Sravan K. Marella, Sachin S. Sapatnekar. A Holistic Analysis of Circuit Performance Variations in 3-D ICs With Thermal and TSV-Induced Stress Considerations. IEEE Trans. VLSI Syst., 23(7):1308-1321, 2015. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: A holistic analysis of circuit timing variations in 3D-ICs with thermal and TSV-induced stress considerationsSravan K. Marella, Sanjay V. Kumar, Sachin S. Sapatnekar. iccad 2012: 317-324 [doi]
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