C. Metzler, Aida Todri, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel. Through-Silicon-Via resistive-open defect analysis. In 17th IEEE European Test Symposium, ETS 2012, May 28th - June 1st 2012, Annecy, France. pages 1, IEEE Computer Society, 2012. [doi]
Abstract is missing.