Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration - researchr publication authors

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Min Miao, Yufeng Jin, Hongguang Liao, Liwei Zhao, Yunhui Zhu, Xin Sun, Yunxia Guo. Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration. In 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009. pages 90-93, IEEE, 2009. [doi]

This author has not been identified. Look up 'Min Miao' in GoogleThis author has not been identified. Look up 'Yufeng Jin' in GoogleThis author has not been identified. Look up 'Hongguang Liao' in GoogleThis author has not been identified. Look up 'Liwei Zhao' in GoogleThis author has not been identified. Look up 'Yunhui Zhu' in GoogleThis author has not been identified. Look up 'Xin Sun' in GoogleThis author has not been identified. Look up 'Yunxia Guo' in Google

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