Min Miao, Yufeng Jin, Hongguang Liao, Liwei Zhao, Yunhui Zhu, Xin Sun, Yunxia Guo. Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration. In 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009. pages 90-93, IEEE, 2009. [doi]
@inproceedings{MiaoJLZZSG09,
title = {Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration},
author = {Min Miao and Yufeng Jin and Hongguang Liao and Liwei Zhao and Yunhui Zhu and Xin Sun and Yunxia Guo},
year = {2009},
doi = {10.1109/NEMS.2009.5068533},
url = {http://doi.ieeecomputersociety.org/10.1109/NEMS.2009.5068533},
tags = {rule-based},
researchr = {https://researchr.org/publication/MiaoJLZZSG09},
cites = {0},
citedby = {0},
pages = {90-93},
booktitle = {4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009},
publisher = {IEEE},
isbn = {978-1-4244-4629-2},
}