Min Miao, Yufeng Jin, Hongguang Liao, Liwei Zhao, Yunhui Zhu, Xin Sun, Yunxia Guo. Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration. In 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009. pages 90-93, IEEE, 2009. [doi]
Abstract is missing.