An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications

A. Micol, A. Zeanh, T. Lhommeau, Stephane Azzopardi, E. Woirgard, O. Dalverny, M. Karama. An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. Microelectronics Reliability, 49(9-11):1370-1374, 2009. [doi]

Abstract

Abstract is missing.