Stephane Azzopardi - researchr alias

researchr

You are not signed in
Sign in
Sign up

Viewing Publication 1 - 17 from 17

2019

2018

Effect of short circuit aging on safe operating area of SiC MOSFETTien Anh Nguyen, Stéphane Lefebvre, Stephane Azzopardi. mr, 88:645-651, 2018. [doi]

2015

2 using BenzoCycloButene as dielectric materialHoussam Arbess, F. Baccar, L. Théolier, Stephane Azzopardi, Eric Woirgard. mr, 55(9-10):2017-2021, 2015. [doi]

2) DiodeF. Baccar, Houssam Arbess, L. Théolier, Stephane Azzopardi, E. Woirgard. mr, 55(9-10):1981-1987, 2015. [doi]

Identification and analysis of power substrates degradations subjected to severe aging testsEric Woirgard, F. Arabi, Wissam Sabbah, D. Martineau, L. Théolier, Stephane Azzopardi. mr, 55(9-10):1961-1965, 2015. [doi]

Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosityToni Youssef, W. Rmili, E. Woirgard, Stephane Azzopardi, N. Vivet, D. M. Meekhof, Régis Meuret, G. Le Quilliec, C. Richard. mr, 55(9-10):1997-2002, 2015. [doi]

2013

Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approachF. Baccar, Stephane Azzopardi, L. Theolier, K. El Boubkari, Jean-Yves Delétage, Eric Woirgard. mr, 53(9-11):1719-1724, 2013. [doi]

Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloyWissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard. mr, 53(9-11):1617-1621, 2013. [doi]

2012

A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallizationF. Le Henaff, Stephane Azzopardi, Jean-Yves Deletage, Eric Woirgard, S. Bontemps, J. Joguet. mr, 52(9-10):2321-2325, 2012. [doi]

2010

Experimental electro-mechanical static characterization of IGBT bare die under controlled temperatureYassine Belmehdi, Stephane Azzopardi, Jean-Yves Deletage, Eric Woirgard. mr, 50(9-11):1815-1821, 2010. [doi]

2009

Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operationYassine Belmehdi, Stephane Azzopardi, A. Benmansour, J.-Y. Delétage, Eric Woirgard. mr, 49(9-11):1398-1403, 2009. [doi]

An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applicationsA. Micol, A. Zeanh, T. Lhommeau, Stephane Azzopardi, E. Woirgard, O. Dalverny, M. Karama. mr, 49(9-11):1370-1374, 2009. [doi]

2007

A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulationA. Benmansour, Stephane Azzopardi, J. C. Martin, E. Woirgard. mr, 47(9-11):1800-1805, 2007. [doi]

Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditionsA. Benmansour, Stephane Azzopardi, J. C. Martin, E. Woirgard. mr, 47(9-11):1730-1734, 2007. [doi]

2004

First step in the reliability assessment of ultracapacitors used as power source in hybrid electric vehiclesWalid Lajnef, Jean-Michel Vinassa, Stephane Azzopardi, Olivier Briat, Alexandrine Guédon-Gracia, Christian Zardini. mr, 44(9-11):1769-1773, 2004. [doi]

2001

Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTsStephane Azzopardi, Atsuo Kawamura, Hideo Iwamoto, Olivier Briat, Jean-Michel Vinassa, Eric Woirgard, Christian Zardini. mr, 41(9-10):1731-1736, 2001. [doi]

Sign in or sign up to see more results.

runs on WebDSL