A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface

Noriyuki Miura, Yusuke Koizumi, Eiichi Sasaki, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura. A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface. In 2013 IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVI, Yokohama, Japan, April 17-19, 2013. pages 1-3, IEEE, 2013. [doi]

Authors

Noriyuki Miura

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Yusuke Koizumi

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Eiichi Sasaki

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Yasuhiro Take

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Hiroki Matsutani

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Tadahiro Kuroda

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Hideharu Amano

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Ryuichi Sakamoto

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Mitaro Namiki

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Kimiyoshi Usami

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Masaaki Kondo

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Hiroshi Nakamura

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