Noriyuki Miura, Yusuke Koizumi, Eiichi Sasaki, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura. A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface. In 2013 IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVI, Yokohama, Japan, April 17-19, 2013. pages 1-3, IEEE, 2013. [doi]
No references recorded for this publication.
No citations of this publication recorded.