Noriyuki Miura, Yusuke Koizumi, Eiichi Sasaki, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura. A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface. In 2013 IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVI, Yokohama, Japan, April 17-19, 2013. pages 1-3, IEEE, 2013. [doi]
@inproceedings{MiuraKSTMKASNUK13,
title = {A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface},
author = {Noriyuki Miura and Yusuke Koizumi and Eiichi Sasaki and Yasuhiro Take and Hiroki Matsutani and Tadahiro Kuroda and Hideharu Amano and Ryuichi Sakamoto and Mitaro Namiki and Kimiyoshi Usami and Masaaki Kondo and Hiroshi Nakamura},
year = {2013},
doi = {10.1109/CoolChips.2013.6547916},
url = {http://dx.doi.org/10.1109/CoolChips.2013.6547916},
researchr = {https://researchr.org/publication/MiuraKSTMKASNUK13},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {2013 IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVI, Yokohama, Japan, April 17-19, 2013},
publisher = {IEEE},
isbn = {978-1-4673-5780-7},
}