Development of wafer thinning and dicing technology for thin wafer - researchr publication authors

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Chuichi Miyazaki, Haruo Shimamoto, Toshihide Uematsu, Yoshiyuki Abe. Development of wafer thinning and dicing technology for thin wafer. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-4, IEEE, 2009. [doi]

This author has not been identified. Look up 'Chuichi Miyazaki' in GoogleThis author has not been identified. Look up 'Haruo Shimamoto' in GoogleThis author has not been identified. Look up 'Toshihide Uematsu' in GoogleThis author has not been identified. Look up 'Yoshiyuki Abe' in Google

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