Chuichi Miyazaki, Haruo Shimamoto, Toshihide Uematsu, Yoshiyuki Abe. Development of wafer thinning and dicing technology for thin wafer. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-4, IEEE, 2009. [doi]
@inproceedings{MiyazakiSUA09,
title = {Development of wafer thinning and dicing technology for thin wafer},
author = {Chuichi Miyazaki and Haruo Shimamoto and Toshihide Uematsu and Yoshiyuki Abe},
year = {2009},
doi = {10.1109/3DIC.2009.5306548},
url = {http://dx.doi.org/10.1109/3DIC.2009.5306548},
researchr = {https://researchr.org/publication/MiyazakiSUA09},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009},
publisher = {IEEE},
}