Chuichi Miyazaki, Haruo Shimamoto, Toshihide Uematsu, Yoshiyuki Abe. Development of wafer thinning and dicing technology for thin wafer. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-4, IEEE, 2009. [doi]
Abstract is missing.