Three-dimensional switchbox multiplexing in emerging 3D-FPGAs to reduce chip footprint and improve TSV usage

Marzieh Morshedzadeh, Ali Jahanian, Payam Pourashraf. Three-dimensional switchbox multiplexing in emerging 3D-FPGAs to reduce chip footprint and improve TSV usage. Integration, 50:81-90, 2015. [doi]

Abstract

Abstract is missing.