Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, H. Hashimoto, Mitsu Koyanagi. Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal. In IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018. pages 4, IEEE, 2018. [doi]
@inproceedings{MurugesanFBHK18,
title = {Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal},
author = {Mariappan Murugesan and Takafumi Fukushima and Ji Chel Bea and H. Hashimoto and Mitsu Koyanagi},
year = {2018},
doi = {10.1109/IRPS.2018.8353589},
url = {https://doi.org/10.1109/IRPS.2018.8353589},
researchr = {https://researchr.org/publication/MurugesanFBHK18},
cites = {0},
citedby = {0},
pages = {4},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018},
publisher = {IEEE},
isbn = {978-1-5386-5479-8},
}