Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, M. Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka. Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-4, IEEE, 2014. [doi]
Abstract is missing.