Module packing based on the BSG-structure and IC layout applications

Shigetoshi Nakatake, Kunihiro Fujiyoshi, Hiroshi Murata, Yoji Kajitani. Module packing based on the BSG-structure and IC layout applications. IEEE Trans. on CAD of Integrated Circuits and Systems, 17(6):519-530, 1998. [doi]

Abstract

Abstract is missing.