V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology

Aqeel Hussain Naqvi, Jeong-Heum Park, Chang-Wook Baek, Sungjoon Lim. V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology. IEEE Access, 7:87907-87915, 2019. [doi]

Authors

Aqeel Hussain Naqvi

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Jeong-Heum Park

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Chang-Wook Baek

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Sungjoon Lim

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