V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology

Aqeel Hussain Naqvi, Jeong-Heum Park, Chang-Wook Baek, Sungjoon Lim. V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology. IEEE Access, 7:87907-87915, 2019. [doi]

Abstract

Abstract is missing.